Thin-Film Encapsulation Market is Poised to Reach USD 223 Million by 2027
The Asia-Pacific region is at the forefront of theThin-Film Encapsulation (TFE) market's rapid expansion, is driven by the robust growth of the consumer electronics sector and substantial investments in OLED technology. With a strong manufacturing base for electronic devices and a rising demand for advanced display technologies, Asia-Pacific is poised to dominate the TFE market. Countries like South Korea, China, and Japan are leading the charge, leveraging technological advancements and increasing applications of TFE in flexible and foldable displays. As the region continues to innovate and expand, its influence on the global TFE market is expected to grow even further by 2027.
The flexible OLED display TFE market for smartphone applications is expected to hold the largest share during the forecast period.
The flexible OLED display TFE market for smartphone applications is expected to hold the largest share during the forecast period. OLED-based smartphones gained instant popularity and are in high demand in the high-end consumer markets. Samsung was the first company to launch a smartphone based on flexible AMOLED display technology and started mass-producing displays in 2014. The company has been utilizing metal foils, glass, TFE, and hybrid encapsulation materials in its display panels. Also, in 2020, Apple used OLED panels for the first time for all the iPhone 12 series, which also continued in the iPhone 13 series and iPhone 14 series.
The thin-film encapsulation (TFE) market for North Americas is expected to hold the second largest size during the forecast period.
The high demand for OLED displays from Apple for its smartphone models has boosted the growth of the TFE market in the US. The demand for TFE in OLED display panels for use in smart wearables is expected to increase during the forecast period due to the presence of leading AR/VR vendors, such as Oculus VR, Microsoft, and Google, in North America. According to IRENA, North America would have the second-highest installed solar PV capacity, reaching 437 GW by 2030, with more than 90% of these installations in the United States. This is expected to drive TFE market in North America.
Key players in the thin-film encapsulation (TFE) market are Samsung SDI Co., Ltd. (South Korea); LG Chem (South Korea); 3M (US); Toppan Inc. (Japan); Ergis Group (Poland); Veeco Instruments Inc. (US); Universal Display Corporation (US); Applied Materials, Inc. (US); Kateeva (US); Toray Industries, Inc. (Japan); tesa (Germany); Ajinomoto Fine-Techno Co., Inc. (Japan); Coat-X (Switzerland); and Borealis AG (Austria).
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