Extreme Ultraviolet (EUV) Lithography: Enabling Next-Generation Semiconductor Manufacturing
Extreme Ultraviolet (EUV) lithography is one of the most advanced and critical technologies in modern semiconductor manufacturing. It enables the production of highly complex and densely packed integrated circuits by using extremely short-wavelength light to print ultra-fine patterns on silicon wafers. As the semiconductor industry continues to pursue smaller, faster, and more energy-efficient chips, EUV lithography has become essential for advanced process nodes such as 7 nm, 5 nm, and below. EUV lithography operates at a wavelength of 13.5 nanometers , which is significantly shorter than the 193 nm wavelength used in deep ultraviolet (DUV) lithography. The shorter wavelength allows chipmakers to create much smaller features with higher precision and fewer patterning steps. This is crucial for producing advanced logic chips used in applications such as artificial intelligence, high-performance computing, 5G, and advanced mobile devices. One of the defining characteristics of EU...