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 The die bonder equipment market plays a vital role in the electronics industry by providing the technology for assembling microchips. Die bonders precisely attach semiconductor dies (integrated circuits) to a substrate, forming the foundation of various electronic devices. Market Growth Driven by Miniaturization and Integration The market is expected to see steady growth due to several factors. One key driver is the miniaturization of electronic components. As devices become smaller and more powerful, manufacturers require even more precise die-bonding techniques. This demand is fueled by the Internet of Things (IoT), where tiny, interconnected devices are becoming increasingly prevalent. Another factor propelling the market is the growing adoption of stacked die technology. This technique involves layering multiple dies on top of each other, creating even more complex and powerful integrated circuits. Die bonders are essential for achieving the high level of accuracy and reliability