Thermal Interface Materials Market, Key Player, Analysis, Type and Business Opportunities, Current Trends, Forecast by 2023

Overview:

Thermal interface materials (TIM) are substances that find use in between two components to facilitate thermal coupling between them. This occurs a lot in needs for heat dissipation where it finds itself as a bridge between a heat-producing device and a heat-dissipating device. The global thermal interface materials market is all set to better its previous stand with a 10% CAGR during the forecast period (2017-2023). Market Research Future (MRFR) claimed possibilities of growth are quite plenty as the global need for a better technical stand is going to soar high in the coming years.

Several factors are expected to play integral roles in ensuring the growth of this thermal interface materials market. Features like the need for very fast computing services and increasing awareness of efficient lighting have quite big industrial impacts due to which the growth of the thermal interface materials market would be substantial.

Segmentation:

The segmentation of the global thermal interface materials market, as directed by MRFR, depends largely on type and application. These two regions were analyzed in detail for the report with proper backing provided by volume-wise and value-wise data.

Based on the type, the global thermal interface materials market can be segmented into greases & adhesives, gap fillers, elastomeric pads, metal-based, and others. The greases & adhesives segment is expected to gain great momentum due to its popularity among OEMs. This is due to features like the flowability of the product and a wide-range of application to protect surface of any housing from roughness, heat spreader, or heat sink surface.

Based on the application, the global thermal interface materials market can be segmented into telecommunications, computer, automotive, industrial machinery, and others. The computer segment is expected to gain significant booster during the forecast period a thermal conductivity is a preferred option in CPUs and GPUs. Components like CPUs, chipsets, graphics cards, and hard disk drives are prone to damage due to overheating, which can be curbed with the use of thermal interface materials.

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Regional Analysis:

North America, Asia Pacific (APAC), Europe, and the Rest of the World (RoW) are regional segments that have been included in the MRFR’s study of the global thermal interface materials market. This region-specific understanding is expected to ensure better planning for companies as it would reveal demographical possibilities.

North America is expected to have the upper hand in the global market as several companies, with substantial market impact, are functioning out of this region. These companies are expected to provide growth possibilities by launching various strategic moves. Innovations, merger, acquisitions, and other factors are expected to promote the regional market. The US and Canada are two countries that impact the global market quite substantially.

The APAC market has substantial growth possibilities due to the increased participation from countries like China, Taiwan, Japan, Thailand, India, and others. The consumer electronics segment is quite bustling in the region, which is expected to create growth possibilities for the region. Rapid development in the industrial sector is promoting the regional market notably. 

Competitive Landscape:

The global thermal interface materials market is gaining privileges from the participation of several associated companies. These companies are Bergquist Company (U.S.), 3M Company (U.S.), Henkel Corporation (U.S.), Parker Chomerics (U.S.), Momentive Performance Materials Inc. (U.S.), Indium Corporation (U.S.), Laird Technologies (U.S.), Dow Corning (U.S.), Zalman Tech Co., Ltd. (South Korea) and others. MRFR enlisted these companies for their latest report on the global thermal interface materials market. They have profiled these companies to understand factors that are controlling their market endeavors. Comprehending latest trends is also at the focal point of this market report.

In August 2019, researchers from the Imperial College London published a new parameter called the Cell Cooling Coefficient (CCC) that has been designed to create a benchmark for thermal performance of all cell designs. This is to prevent thermal leaking and help the automotive industry in booming.